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Embedded DRAMs: Today and Toward
System-Level Integration

A half-day seminar on the challenges and opportunities
offered by Merged DRAM/Logic Devices

Presenter: Steven Przybylski, Principal Consultant

Click Here to Register (Secure page)
Click Here to Register (Non-secure)

Embedded DRAMs are widely seen as an important technology for many current and future applications. As the industry moves to 1 million gate ASICs and PLDs, the availability of large amounts of on-chip storage will be required in many instances. This new and up-to-date seminar covers all aspects of embedded DRAMs today and tomorrow, with a special emphasis on the role they will play in large-scale System-Level Integration ICs.

General Admittance Presentations:

• There are no general admittance presentations planned for the second half of 1998
• To inquire about corporate presentations, please send email to cs@verdande.com

Synopsis: The technology, challenges, and opportunities offered by Merged DRAM/Logic devices.

• Background tutorial
• The architectural imperative
• Technology and testing challenges
• Current activity in the field
• Applications suited to short-, medium-, and long-term use of embedded DRAMs
• Immediate opportunities with Merged DRAM/Logic devices
• Implications for System-Level Integration

Who will Benefit:

• Technology planners and strategic marketers
• System architects and implementers
• Technology analysts
• Engineering and marketing management
• Both technical and semi-technical audiences
  

Topics Covered:

• Introduction
  • Goals and Context of the Seminar
    
• Background Information
  • What are Merged DRAM/Logic Devices
  • DRAM Operation and Fabrication Basics
  • What is Easy and What is Hard About DRAMs
    
• Technology and System Trends
  • DRAM Technology Trends
  • System Trends
  • Fill Frequency: The Opportunities for Embedded DRAMs
    
• Technology and Testing Challenges and Opportunities
  • Similarities and Differences Between Logic and DRAM
    • Process
    • Circuit and Logic Design
    • Testing and Manufacturing
    • Business Issues
  • Process Options for Merged DRAM/Logic Devices
    • DRAM Process
    • ASIC Process
    • Blended Process
  • Testing Challenges
  • Yield, Cost and Profits
    
• Existing Embedded DRAM Devices
  • GUI and Graphics Accelerator Chips
  • Embedded and Parallel Processors
  • Network Devices
  • Cache Devices
  • Programmable Logic with DRAM
  • Specialty DRAMs
  • Other Device Types
    
• Short-, Medium-, and Long-Term Applications for Embedded DRAMs
  • Power-Motivated Opportunities
  • Form-Factor-Motivated Opportunities
  • Bandwidth- and Latency-Motivated Opportunities
  • Granularity-Motivated Opportunities
  • Multiply-Motivated Opportunities
    
• Implications for System-Level Integration (SLI)
  • The Business and Technical Challenges of SLI
  • The Role of Embedded DRAMs in SLI
    
• Market-Size Estimates
  • Market Size Estimates for Several Styles of Embedded DRAM Device
    
• Conclusions and Q&A

Click Here to Register (Secure page)
Click Here to Register (Non-secure)

Questions?  Send email to cs@verdande.com for answers

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