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The New DRAMs for Main Memory and Graphics

A comprehensive full-day seminar on the current and future commodity DRAM marketplace by the industry's leading independent systems-oriented analyst.

Presenter: Steven Przybylski, Principal Consultant

Summary
Outline
Who Will Benefit From This Seminar
Detailed Table of Contents
Examples From the Presentation

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General-Admittance Presentations:

Summary

A short year after the PC industry abruptly shifted to EDO DRAMs, it is transitioning again--this time to Synchronous DRAMs. Even as the industry adjusts to this new architecture, Intel and the DRAM vendors are indicating that another major change is less than two years away.

These and many other questions are answered in this full-day seminar presented by one of the DRAM industry's leading independent systems-oriented analysts.

Outline

This seminar is the most comprehensive review of DRAM technology offered. You will walk away with the most important assets possible for decision making: an understanding of how the alternatives stack up and which are most likely to succeed. The seminar covers:

Morning: The seminar begins with the basic computer system and semiconductor processing trends that are motivating the many new DRAM architectures. A new metric is introduced that clearly illustrates why the DRAM industry is in such turmoil now. More significantly, this unique analysis highlights the ongoing challenges that face the industry as it moves toward the 256-Mbit and 1-Gbit generations. The morning concludes with a detailed examination of the characteristics, strengths and weaknesses of the many variations of the new main memory DRAMs: EDO, Burst EDO, SDRAM, EDRAM, CDRAM, RDRAM, and SynchLink.

Afternoon: The seminar's second half analyzes the important differences between main memory and graphics uses of DRAMs. All the graphics-oriented DRAMs are also contrasted: EDO, VRAM, SDRAM and SGRAM, RDRAM, MDRAM, WRAM, 3D-RAM. Additionally, the impact of the new DRAM technologies on system architecture will be discussed in the context of the Accelerated Graphics Port (AGP), Unified Memory Architecture (UMA), and the cost-performance trade-offs of processor speed versus memory size.

Finally, the growing attractiveness of combining logic and DRAM in a single device will be explored in depth from the merged perspectives of technology capabilities and application requirements. After characteristics of several recently announced merged DRAM/logic products are described, a road map highlighting those applications best suited to take advantage of this new class of device will be developed.

Who Will Benefit:

Detailed Table of Contents

Examples From The Presentation Materials

Questions?  Send mail to cs@verdande.com for further details

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